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Research on the Application of Thermally Conductive Silicone Resin

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    Screen-printed thermally conductive greases, with their low viscosity, excellent flowability, and uniform distribution, are widely used in large-area heat dissipation interfaces. However, for applications with extremely high insulation requirements, high-insulation flowable thermally conductive greases present several problems. For example, they have low thermal conductivity, high thermal resistance, poor aging resistance, and are prone to drying and powdering in high-temperature and high-humidity environments. Furthermore, their high viscosity and poor rheological properties are unfavorable for screen printing operations. These problems prevent these products from effectively solving the heat dissipation problems of high-power electronic components.

    Generally, thermally conductive greases with rheological properties exhibit shear-thinning characteristics, which gives them good spreadability during use, facilitating application. They also possess advantages such as good storage stability. Nevertheless, how to further optimize high-insulation flowable thermally conductive grease products to address their shortcomings in heat dissipation for high-power electronic components remains a problem that requires in-depth research and discussion. When applied to interfaces, such as between large server chips and heatsinks, this thermal grease ensures its flowability is precisely confined within the target interface, preventing sagging. However, high thermal conductivity rheological thermal greases on the market, despite possessing stirring and thixotropic properties, rely on thixotropic agents to increase viscosity, resulting in higher thermal resistance.

    Furthermore, although it exhibits some thixotropy, the shear thinning characteristic is not significant due to increased system viscosity; the viscosity decrease after shearing is small, leading to poor flowability. More concerningly, during long-term use, after multiple thermal cycles, the heat source and heatsink undergo slight deformation, which can easily lead to grease migration. The resulting problem is the separation of the silicone oil from the thermally conductive filler, causing the thermal grease coating to become dry and fragmented. All of this not only weakens the thermal conductivity of the thermal grease but may also cause thermal runaway between the heat source and heatsink.


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