Commonly Used Thermal Conductive Materials in Electronic Products

As electronic products continue to become smaller and thinner, the demand for high-performance thermal conductive encapsulants is increasing. Adequate thermal conductivity in electronic devices is crucial for enhancing user experience. Today, let's discuss the commonly used thermal conductive materials in electronic products!

High thermal conductive encapsulants are designed to meet the thermal conductivity requirements of electronic devices, providing excellent and reliable performance. These materials address potential thermal issues in electronic devices, offering effective solutions for highly integrated and ultra-thin devices. The widespread application of thermal conductive products has significantly improved the reliability of electronic products.

In the electronics industry, common thermal conductive products include:

1. Thermal Conductive Pads:

• Purpose: High-performance gap-filling thermal conductive material used between electronic devices and heat sinks or product casings.

• Characteristics: Good viscosity, flexibility, compressibility, and excellent thermal conductivity. Eliminates air gaps between electronic components and heat sinks, improving heat dissipation.

2. Thermal Conductive Silicone Grease:

• Purpose: High-performance thermal compound with excellent thermal conductivity and non-solidifying, non-conductive properties. Ideal for achieving optimal thermal conduction between CPUs, GPUs, and heatsinks.

3. Thermal Conductive Silicone Gel:

• Purpose: Single-component, thermally conductive, room-temperature-curing organic silicone adhesive and sealing gel.

• Characteristics: Outstanding resistance to thermal cycling, aging, and electrical insulation. Features excellent moisture resistance, shock resistance, corona resistance, and chemical resistance.

4. Thermal Conductive Filling Gel:

• Characteristics: High thermal conductivity and electrical insulation, rapidly conducts heat away from the heating element, providing excellent cooling effects.

5. Thermal Conductive Insulating Encapsulant:

• Purpose: Suitable for sealing electronic components with high thermal requirements.

• Characteristics: After curing, it exhibits good thermal conductivity, excellent electrical insulation, good adhesion, and a glossy surface finish.

6. High Thermal Conductive Insulating Encapsulant:

• Purpose: Dual-component material with high thermal conductivity (≥3.5W/m·K), electrical insulation, flexibility, low coefficient of linear expansion, and low dielectric constant.

• Applications: Used in automotive electronic components, power modules, LED lighting modules, communication modules, and more.

These thermal conductive materials play a critical role in ensuring efficient heat dissipation and maintaining the overall reliability of electronic products. The selection of the appropriate material depends on specific application requirements and thermal management needs.